(龍門式)桌上型自動點塗膠機
FDP-300DT/400DT
Characteristic
- 機槭結構：線性滑軌搭配滾珠螺悍傳動，剛性強〈AC伺服馬達驅動〉。
- Z軸負荷：20kg 可搭配多針頭夾具產能培增。
- 治具盤定位：治具盤靠邊定位於床台上，無工件晃動之考慮。
Detail
| Dispense Area | ||
|---|---|---|
| FDR-300DT/400DT | X -Y - Z strok | 300x300x50mm / 400x400x50mm |
Mechanical
- 1. Drive Motor: X-Y-Z: Made in Taiwan150W AC Servo motor
- 2. Drive Structure : Linear Guide +Ball Screw
- 3. Axis Speed : X-Y: Axis speed:300mm/sec Z: Axis speed:250mm/sec
- 4. Resolution: 0.01mm
- 5. Repeat Precision: ±0.025mm
Control Sys.
- 1. Controller : Industrial PC with 500MHz Celeron CPU & 15” LCD color monitor. Interactive POP-UP MENU easy to learn & use
- 2. X-Y-Z data/program : 1000 points
- 3. Qty of programs : 1200 programs
- 4. Patterns available : Point, Line, Arc, Circle, Square or Circular Area fill-up
- 5. Program method : Teaching by Joystick or Editing by key board or DXF file.
Dispensing
- 1. Dispensing rate(dots/hr): 11500dph。
- 2. Line/Arc speed : 250/250mm/sec。
- 3. Dispensing method :
A. Syringe drived by air(suitable for small quantity easy solidified glue)Applied on : Silver glue, Red glue, UV glue, SMD LED ( Epoxy ) Conductive glue for cell phone ,Tin cream, PCB Solder glue.
B. Air On/Off Valve(suitable for large quantity nonstick & easy dripped glue) Applied on COB(Epoxy), LCD COG(Silicon) Instantaneous glue,UV glue.
C. Lead screw valve(suitable for very sticky glue, high precision) Applied on : IC encapsulate process like COB, Lead frame for Silver glue, Red glue, Tin cream, BGA DAM & FILL.
Facility Requirement
- 1. Power:10,50~60Hz，110V/220V,650W
- 2. Pneumatic: 3.5~7kg/cm2(50~100psi)
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