料盤回流自動點塗膠機
FDP-520-SRL
Characteristic
- 三料盤循環，降低料盤損耗。
- 迴圈設計，不需人力移載料盤。
- 萬向轉珠搭配無桿缸，一載平順、高效能。
- 啟動按鍵互鎖，人員操作安全無慮。
- 馬達傳動及輸送，低噪音。
- 進料、收料均符合人體工學及節省佔地空間。
Detail
| Dispense Area | ||
|---|---|---|
| FDP-320/520 | X -Y - Z strok | 320x320x50mm/520x520x50mm |
Mechanical
- 1. Drive Motor : X-Y:日本SINANO 300W AC Servo Z : 日本SINANO 300W AC 伺服
- 2. Drive Structure : Linear Guide +Ball Screw
- 3. Axis Speed :axis speed X-Y:300mm/sec,Z:200mm/sec
- 4. Resolution : 0.01mm
- 5. Repeat Precision : ±0.025mm
Control Sys.
- 1. Controller : 相容PC/AT PENTIUM CPU15" LCD 螢幕，視窗交談式操作，易學好用。
- 2. X-Y-Z data/program : 1000 points
- 3. Qty of programs : 1200 programs
- 4. Patterns available : Point, Line, Arc, Circle, Square or Circular Area fill-up
- 5. Program method: Teaching by Joystick or Editing by key board or DXF file
- 6. 可讀取Auto CAD.DXF檔，塗膠路徑設定快速，3分鐘搞定(點,線,弧,圓,變形曲線)。
Dispensing
- 1. Dispensing rate(dots/hr) : 11500dph。
- 2. Line/Arc speed : 250/150mm/sec。
- 3. Dispensing method :
A. Syringe drived by air(suitable for small quantity easy solidified glue). Applied on : Silver glue, Red glue, UV glue, SMD LED ( Epoxy ). Conductive glue for cell phone ,Tin cream, PCB Solder glue.
B. Air On/Off Valve(suitable for large quantity nonstick & easy dripped glue) Applied on COB(Epoxy), LCD COG(Silicon) Instantaneous glue,UV glue.
C. Lead screw valve(suitable for very sticky glue, high precision) Applied on : IC encapsulate process like COB, Lead frame for Silver glue, Red glue, Tin cream, BGA DAM & FILL.
D. Jet valve, Spray valve, etc…….
Facility Requirement
- 1. Power : 1ψ , 50~60Hz , 110V/220V, 1200W
- 2. Pneumatic : 3.5~7kg/cm2(50~100 psi)